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Silicon in weeks, not years.
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Intelligent agents for RTL Generation.
Our multi-agent platform automates the full silicon lifecycle.
Target Spec
2.5D
7nm finfet ASAP7
Design History
Trusted by engineers from
Why Now?
Chip design today is slow, expensive, and talent-constrained — a single ASIC can take years, cost tens of millions, and require scarce experts.
At the same time, demand for specialized AI chips is surging, with the edge AI market projected to hit $77B by 2030.
Every new generation of LLMs, vision models, robotics stacks, and multimodal systems demands new hardware. Slow chip design cycles are now the limiting factor for AI progress.
Chip design today is slow, expensive, and talent-constrained — a single ASIC can take years, cost tens of millions, and require scarce experts.
At the same time, demand for specialized AI chips is surging, with the edge AI market projected to hit $77B by 2030.
Every new generation of LLMs, vision models, robotics stacks, and multimodal systems demands new hardware. Slow chip design cycles are now the limiting factor for AI progress.
